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Electronic Motion Systems UK Ltd
Swansea, South Wales, UK, Manufacturing of Automotive Modules and Systems Products

Wales Facility (Swansea, UK)

  • State-of-the-art Facility
  • Qualified ISO 14001/TS 16949
  • Class 10,000 Clean-Room, ESD controlled environment
  • 80,000 Sq feet, expandable to 300,000 Sq feet
  • Commenced Operations in 1999

 

Manufacturing Services

SMD Pick & Place

PCB ID with barcode scan

Automated Optical Inspection (AOI)

Solderability testing

 
SEM/EDX analysis

SMT Fine pitch pick & place
EMS Assembly Line
Vacuum Solder Oven
X-Ray Inspection
Functional Testing
  • Custom design and manufacturing
  • Design support
  • Design For Manufacturing (DFM)
  • Prototyping
  • New Product Introduction (NPI)
  • Low / Medium volume capacity
  • Printed Circuit Board (PCB) assembly to IPC610 class 3 standards
  • Sub assembly
  • Full product assembly
  • Final functional and continual conformance testing
  • Supply chain management
  • Warehousing and logistics
  • Full product and component lot traceability
  • Through to after market services which includes repair and rework

 

Test and Validation Services

  • 100% in line 3D, full volumetric solder paste measurement and inspection
  • 100% in line Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • ICT/FFT/CC test systems
  • JTAG Boundary Scan
  • Automated Flash / OTP Programming
  • Parametric testing
  • Avalanche (ruggedness) / Zth / Rth (thermal management) test capabilities
  • Bespoke functional test fixtures - in house design & manufacture
  • Functional test systems - in house design & manufacture
  • Burn In / Soak Test
  • Solderability testing (MUST II)
  • SEM/EDX analysis
  • HALT/HASS life cycle testing, including accelerated ageing and thermal shock
  • Shock & vibration testing
  • Autoclave
  • Temperature and humidity testing
  • Ionic contamination testing
  • In house EMC test capability to CISPR 25 level 5
  • All validation testing conducted to IPC/EIA/JIS/Mil standards (alternative standards can be accommodated)

 

Manufacturing Technology (PCB)

  • Double and single sided reflow
  • Full no clean processes
  • SMT chip replacement (0402, SOIC, TSSOP, PLCC, QFP capability)
  • SMT Fine pitch/odd form (QFP, BGA, Flip Chip, PLCC and odd form components up to 150mm * 50mm down to 0.3mm pitch with coplanarity detection)
  • In line 3D solder paste inspection with full volumetric measurement and inpsection
  • In line automatic optical inspection, with solder joint, orientation and character recognition
  • Pb and Pb Free (RoHS and WEEE compliant) Capability
  • In-circuit, full functional and CC test capability
  • Automated Flash Micro programming capability
  • Automated Pb and Pb free wave soldering process
  • Automated Pb and Pb free selective soldering process
  • Automated Conformal Coating Process
  • Product integration with mechanical housing assembly and final functional testing

 

Special Processes

  • Dynamic Laser trimming of thickfilm resistors
  • Solder stop application
  • Solder paste printing
  • Solder paste dispensing
  • Adhesive, expoxy and silicon gel dispensing
  • Bare die Pick & Place
  • Wire bonding (wedge-wedge, stitch, gate-source)
  • Forced air convection reflow soldering
  • Vacuum reflow soldering
  • X-Ray inspection
  • Automatic Optical Inspection (AOI)
  • Cleaning
  • Flame soldering
  • Resistance welding
  • Potting, conformal coating
  • Assembly (module - PCB etc)
  • Parametric testing
  • Avalanche (ruggedness) testing
  • Zth & Rth (thermal management) testing
  • Functional Testing
  • Maverick Testing