Electronic Motion Systems’ Design Capabilities for Application-Specific Power Modules and Sub-Systems
We take the designs to full qualification to ensure reliable performance. We have system level testing capabilities to qualify the functionality and reliability of the power system.
We can test and validate power system designs up to 20kW. Designs are validated in application with thermocouples and infra-red imaging.
PROTECTION FEATURES
Over-current protection:
• Shutdown
• Current limiting
Over-temperature protection:
• Latched or hysteretic
ESD protection
FEATURES AT A GLANCE
40v MOSFET with embedded protection and charge pump in a single package
As low as 1 mOhm RDS(on) in the TO-220 footprint
Integrated low EMI charge pump allows direct logic input
Benchmark industry ratings:
- Highest load current rating with current up to 75A
- Active clamp for inductive loads
- Open-load detection (HSS)
- Up to 20kHz frequency for Low Side Switches (LSS)
THE Electronic Motion Systems ADVANTAGE
- Most rugged, efficient and compact switches fir the harshest environments
- Provides charge pump and full switch protection with no additional circuitry
- Up to 30% smaller PCB area than a discrete charge pump circuit
- More than 1000 times longer life than electro-mechanical relays due to self protection and absence of wear and tear
- Up to 20% lower on-resistance than relays reduces heat dissipation and heat sinks
ELECTRICAL DESIGN
Electronic Motion Systems approaches electrical design from a system prospective to make optimal trade-offs between technologies based on the specific application needs. Electronic Motion Systems has developed a solid experience in a wide range of power electronics topologies and techniques, in particular 3-phase inverter for motor drive applications and DC-DC converters.
Innovative design techniques such as integrated inverter and driver circuitry and integrated current sampling techniques simplify designs.
Building on our intimate knowledge of power switches, we have developed proprietary device, thermal and system models to calculate and simulate power losses accurately and reliably as well as predict device junction temperature.
System models take into account all relevant operating parameters; from modulation strategy to gate drive resistors. System models
are available for a variety of topologies, including resonant and
quasi-resonant.
The application of these proprietary models results in minimum die size for a given reliability requirement. With silicon design in house, we can obtain the exact die size requirements in a short time.
Optimum die sizes combined with a clear understanding of the power dissipation of the circuits are key in designing compact and reliable packaging.
Electronic Motion Systems offers state-of-the-art thermo-mechanical design processes and tools to deliver compact, highly reliable customized subsystems.
We have leading expertise in process and substrate technologies to provide the best thermal management solutions along with the mechanical interface suitable for high volume automated manufacture.
In-house mechanical design allows better integration of electrical, physical and thermal requirements. Thermal performance is simulated with finite element analysis (FEA) software and proprietary software modules.
use a variety of techniques to enhance the performance and reliability of the package such as:
• Simulation of wirebond and die attach fatigue
• Calculation, simulation and validation of transient temperature distribution
• Thermal design of fluid dynamic systems
• High temperature die attach
• High current silicon connectors
• Leadframe technology to reduce inductance and interconnections
• Laser trimming
• Flip chip reflow soldering
FEATURES AT A GLANCE
- Thermo-mechanical design
- Process technology
- Innovative designs for improved thermal management and reliability
- Designed to integrate seamlessly into customers' automated assembly process
We have design expertise in a variety of substrate or base material systems such as thick film, isolated metal substrate (IMS), direct bonded copper (DBC) and die on substrate-less housing (Electronic Motion Systems proprietary) designs. We have in-house thick film capability, and our proprietary substrate-less design eliminates a separate part. Thermal stacks are optimized for cost and performance for each specific application:
Conductor #1
Conductor #2
Resistor #1
Resistor #2
Resistor #3
Glass Layer
• Thick film: simple and cost-effective tool to implement more complex functions
• Isolated Metal Substrate: rugged and inexpensive, good for applications requiring high and low power on the same substrate
• Direct Bonded Copper (AlN or Si3N4, or Al203): good to excellent thermal properties and temperature coefficient matching to silicon
• Substrate-less; proprietary solution for compact designs
CAD mechanical design
PWM fan controller
ISA half-bridge module
Three Phase power module
Hybrid Thickfilm substrate featuring flip chip soldering, laser trimming, wire bonding, high temperature die bonding and flame soldering.
We provide complete control PCB design using Protel™ for schematic capture and PCB layout. EMI design and test is an integral part of the design, as well as reliability prediction, using Relex™.
With specific expertise in automotive embedded motor control, Electronic Motion Systems can integrate the control hardware and software development with the power stage design. Our proprietary modulation techniques deliver high-efficiency, low EMC, and low output harmonics.
Our system level approach leads to the optimal trade-offs between hardware and software and allows integration of analog and digital hardware design, leveraging our experience with numerous cost effective fixed point processors, both microcontrollers and Digital Signal Processors (DSPs). We also offer ASIC definition, design and project management capabilities. Our experience spans various motor types and control techniques such as BLDC, PMSM, AC induction and SR.
We are fully equipped for complete control system algorithm development, using MATLAB/SIMULINK™, PSIM™ for control system simulation.
Our proprietary control algorithms include:
• Trapezoidal control of BLDC motors
• Phase advance and conduction angle control algorithms for BLDC motors
• Sinusoidal field-oriented control of PMSM motors
• Software resolver to Digital Converter
• Shunt Current Reconstruction
• Sensored and sensorless field-oriented AC motor control
We take the designs to full qualification to ensure reliable performance. We have system level testing capabilities to qualify the functionality and reliability of the power system. We can test and validate power system designs up to 20kW. Designs are validated in application with thermocouples and infra-red imaging.
Power system test capabilities include:
• Electronic test rack (identical to test equipment used in manufacturing)
• Climate chambers for temperature cycling/operational life test
• Shaker for vibration tests
• Combined vibration/thermo-cycle tester
• Temperature and humidity environmental test chambers
• ESD simulator
• Transient test to ISO-7637 and OEM standards
• Conducted and radiated EMI pre-screen capability
• Automated system and software test
• CAN network testing
• Various dynamometers up to 24 Nm
• Precision torque transducer
• Customized computer-controlled endurance testing: extremes of temperature, load, voltage, on-off cycles,etc
