New power packaging technology from Electronic Motion Systems solves design challenges found in electro-hydraulic power steering (EHPS), electric power steering (EPS) and automotive Motor Control applications. Electronic Motion Systems’ CoolPAKTM modules create a viable path to the transition from hydraulic steering systems to EHPS and EPS systems.
CoolPAK Power Module
Electronic Motion Systems’ new patent-pending CoolPAKTM power inverter packaging technology delivers the lowest package inductance and resistance by minimizing the number of layers to improve thermal performance while reducing the number of interconnections.
Lower thermal resistance allows the use of smaller silicon devices, and lower inverter electrical resistance allows for higher current capabilities. For medium to high power applications, DOL packaging offers better electrical conductivity and increased thermal performance than alternative packaging methods using insulated metal substrate (IMS), direct-bonded copper (DBC) to a ceramic substrate, thick film substrates or PCB based modules, which primarily utilize discrete power devices.
-Simplicity: lower number of components (no DBC or IMS substrates)
- Minimum number of layers along the thermal path for low Rthj
die-to-heatsink
- Low package electrical resistance and inductance for low
power losses
- Lower Junction Temperature and/or Die Size
THE Electronic Motion Systems ADVANTAGE
160A, 120A
Lowest overall inverter terminal-to-terminal electrical resistance less than 4mOhm at 25°C. This includes 0.3mOhm current sense resistor and two MOSFETs in series
Temperature sense feedback
DC bus current sensing
160A, 120A
High frequency, low inductance EMC capacitor across negative and positive bus
Low temperature coefficient of on-resistance due to automotive-specific trench MOSFET technology
Simplified manufacturing processes: low number of components - no IMS or DBC substrates
APPLICATIONS
- Electrical power steering
- Electro-hydraulic power steering
-Automotive brushless DC motor control
CoolPAK Power Module
Specifications
Part Number
VDS
RDS
(on)@25°C
CIRMS
MAX(1)
Rthj-case
Module Loop Resistance
Package Resistance(2)
Package Inductance
11867-E01
40V(*)
~ 0.81mΩ(*)
160A
~ 0.40°C/W
~ 3.8mOhms
~ 1.95mOhms
~ 25nH
11867-E01
40V(*)
~ 0.81mΩ(*)
130A
~ 0.60°C/W
~ 5.6mOhms
~ 2.15mOhms
~ 30nH
(*) Parameter depends on the MOSFET chosen and can be changes to meet application requirememnts.
(1) Values correspond to base-plate temperature of 100°C and Rthjs=0.8°C/W or Rthjs=1.1°C/W subject to 175°C
(2Values include a 0.3mOhm Current Sense Resistor. Loop resistance is the electrical resistance between battery plus and a battery minus terminal with phase terminals shorted.
